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Properties
Excellent in wire-bonding workability with excellent hot hardness.
Excellent in adhesion to copper foil or to adhesive agent
Excellent in insulation resistance.
Excellent in chemical resistance
Low temp. Curable (Max. 160C )
Compared with PI film, Excellent in demensional stability with proper stiffness
Applications
IC substrate for Smart cards
IC substrate for BGA, CSP or COB
Small size LCD driver substrateProperties
Excellent in wire-bonding workability with excellent hot hardness.
Excellent in adhesion to copper foil or to adhesive agent
Excellent in insulation resistance.
Excellent in chemical resistance
Low temp. Curable (Max. 160C )
Compared with PI film, Excellent in demensional stability with proper stiffness
Applications
IC substrate for Smart cards
IC substrate for BGA, CSP or COB
Small size LCD driver substrate
Glass Epoxy Tape
